SF-BGA354A-B-74 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
15.25
2
A1
0.75 TYP
2
1
15.25
13.50
TOP VIEW
13.50
ITEM
NO.
1
2
DESCRIPTION
non-clad substrate; 15.254mm
sq., 19x19 array, 0.75mm pitch,
BGA354
Material
High temperature substrate
P-S527A, 0.8mm Giga-snaP
receptacle
Shell: Brass Alloy 360; 0.25µm [10µ”]
Au over 2.54 µm [100µ”] Ni finish
Contact: BeCu Alloy 172; 0.25µm [10µ”]
Au over 1.27 µm [50µ”] Ni finish
3
Solder Ball, 0.4572mm dia
SEE TABLE
SIDE VIEW
2.56
0.36
PART NO.
SUFFIX
SOLDER BALL ALLOY
-74
-74F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot BGA354 19x19 array 0.75 pitch 15.254 sq.mm
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA354A-B-74 Drawing
SF-BGA354A-B-74F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
STATUS: Released
DRAWN BY: M. Raske
FILE: SF-BGA354A-B-74 Dwg
SHEET: 1 OF 1
SCALE: 4:1
DATE: 07/16 2015
REV. A