SF-BGA324J-B-42 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Patent Pending
Ordering Information:
Top View
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-42
Sn96.5Ag3.0Cu0.5
-42F*
*RoHS Compliant
1.00mm
[0.039"]
23.00mm
[0.906"]
1.00mm
[0.039"]
1mm typ.
1.33mm
[0.052"]
Detail A
2.36mm _{Side View}
[0.093"]
2.87mm
[0.113"]
1
3
4
Detail A
2
0.51mm
[0.020"]
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]}
FR4/G10 or equivalent high temp material. (RoHS)
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
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Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
4 _{Solder Balls (See table above)}
Description: Giga-snaP BGA SMT Foot
R
324 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
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2
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA324J-B-42(F) Drawing
Status: Released
Scale: 4:1
Rev: C
R
1
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Drawing: B Fedde
Date: 8/24/04
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Tele: [phone]
www.ironwoodelectronics.com
File: SF-BGA324J-B-42 Dwg
Modified: 1/9/06
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