SF-BGA318A-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
0.7mm [0.028"]
0.7mm
[0.028"]
15mm
[0.591"]
0.8mm typ.
Side View
13.6mm square [0.535"]
15mm [0.591"]
0.2mm dia.
[0.008"]
4.55mm
1
3
1.59mm
2
0.36mm ± 0.05mm
[0.014" ± 0.002"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material;}
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 ^{Solder Balls: Sn63Pb37}
Description: Giga-snaP BGA SMT Foot
318 position terminal pins (0.8mm centers, 18x18 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA318A-B-61 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 5:1
Rev: B
Drawing: A. Evans
Date: 05/28/09
File: SF-BGA318A-B-61 Dwg.mcd
Modified: 09/02 14