SF-BGA292F-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
Orientation Mark
17.00
TOP VIEW
0.80 typ.
4.8866 4.55
0.36±0.05
0.2032
1
3
2
ITEM
NO.
1
2
3
DESCRIPTION
Terminal Pin
Solder Ball
Substrate
MATERIAL
Plating: 0.25μm [10μ"] Au
over 1.27μm [50μ"] Ni (min.).
SN96.5 AG3.0 CU0.5
High temp substrate
FRONT VIEW
Description: Giga-Snap BGA292, 20x20 array, 0.8mm pitch, 17mm sq.
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA292F-B-61F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 1.49
Doc
Rev
Date
A 8/21/15
STATUS: Released
ENG: E. Smolentseva
FILE: SF-BGA292F-B-61F
Initials Description
ELS Original
SHEET: 1 OF 1
DRAWN BY: E. Smolentseva
DATE: 8/21/15
REV. A
SCALE: 4:1