SF-BGA292A-B-32 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
2
1
1.50 x 45
24.13
24.13
ISO TOP VIEW
3
TOP VIEW
27.00
ISO BOTTOM VIEW
2.36
FRONT VIEW
2.84
0.66
ITEM
NO.
1
2
3
DESCRIPTION
High Temp Substrate
High Density Gigasnap Pin
Solder Ball, 0.030" Dia (See Table)
Description: Female emulator foot for BGA292
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA292A-B-32F Drawing
SF-BGA292A-B-32(F) Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 3.03
PART NO.
SUFFIX
SOLDER BALL ALLOY
-32 Sn63Pb37
-32F* Sn96.5Ag3.0Cu0.5
*RoHS Compliant
STATUS: Released
ENG: E. Smolentseva
FILE: SF-BGA292A-B-32 Dwg
SHEET: 1 OF 1
DRAWN BY: M. Raske
DATE: 12/09/2015
REV. A
SCALE: 2:1