SF-BGA272C-B-42 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Patent Pending
Ordering Information:
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-42
1.00mm
[0.039"]
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
-42F*
21.00mm
[0.827"]
Top View
21.00mm [0.827"]
1.00mm [0.039"]
1.0mm typ.
1.33mm
[0.052"]
Side View
2
3
2.87mm
[0.113"]
1
4
2.36mm
[0.093"]
Detail A
0.51mm
[0.020"]
Detail A
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
1 ^{Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]}
FR4/G10 or equivalent high temp material.
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
4 _{Solder Balls: See table above.}
Description: Giga-snaP BGA SMT Foot
272 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA272C-B-42(F) Drawing
Status: Released
Scale: 4:1
Rev: B
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: H. Hansen
File: SF-BGA272C-B-42 Dwg
Date: 11/14/05
Modified: 1/15/07