SF-BGA257D-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

1.1mm [0.043"]
1.1mm
[0.043"]
15mm
[0.591"]
0.8mm typ.
Top View
12.8mm square [0.504"]
15mm [0.591"]
0.2mm dia. [0.008"]
2
4.54mm [0.179"]
1
Side View
3
0.36mm ± 0.05mm [0.014" ± 0.002"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material;}
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 _{Solder Balls: Sn63Pb37}
Description: Giga-snaP BGA SMT Foot
257 position terminal pins (0.8mm centers, 17x17 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA257D-B-61 Drawing
Status: Released
Scale: 6:1
Rev: B
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: S. Huang
File: SF-BGA257D-B-61 Dwg.mcd
Date: 5/16/2012
Modified: 07/02/14