SF-BGA256K-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
TOP VIEW
15.00
12.80
0.80 typ
2
1
0.2032
PART NO.
SUFFIX
SOLDER BALL ALLOY
-61
-61F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
3.53
1.59
FRONT VIEW
3
0.36±0.05
1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material;
Non-clad
2 Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 Solder Balls: See Table.
Description: Giga-SnaP BGA foot, 17x17 array, 0.8mm pitch 15mm sq.
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise.
Materials and specifications are subject to change without notice.
SF-BGA256K-B-61 Specification
SF-BGA256K-B-61F Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
MATERIAL:
N/A
FINISH:
N/A
WEIGHT: 0.90
STATUS: Released
ENG: S. Faiz
File: SF-BGA256K-B-61
SHEET 1 OF 1
Drawn By: D. Hauer
DATE: 12/09/13
REV. A
SCALE: 4:1