SF-BGA256A-B-72 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.44mm
[0.056"]
1.44mm
[0.056"]
27.00mm
[1.063"]
Patent Pending
1.27mm
[0.050"]
Side View
27.00mm
[1.063"]
3
3.51mm
[0.138"]
2
4.09mm
[0.161"]
1
4
24.13mm [0.950"]
0.58mm
[0.023"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material.
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Foot
4 Balls: Eutectic Sn96.5 Ag3.0 Cu0.5.
256 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA256A-B-72 Drawing
Status: Released
Scale: 4:1
Rev: A
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: A. Evans
File: SF-BGA256A-B-72 Dwg
Date: 6/18/08
Modified: