SF-BGA240N-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

0.6mm
[0.024"]
0.6mm
[0.024"]
18mm [0.709"]
18mm
[0.709"]
0.8mm typ.
Top View
16.8mm square [0.661"]
0.2mm dia.
[0.008"]
2
4.55mm ± 0.254mm
[0.179"±0.010"]
1
Side View
0.8mm typ.
3
0.35mm±0.254mm
[0.014"0.010"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 Solder ball: Sn96.5Ag3.0Cu0.5
Description: Giga-snaP BGA SMT Foot
240 position terminal pins to 240 position solder balls (0.8mm centers, 22x22 array)
RoHS
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA240N-B-61F Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 6:1
Rev: D
Drawing: J. Glab
Date: 04/10/07
File: SF-BGA240N-B-61F Dwg.mcd
Modified: 07/02/14