SF-BGA196C-B-42 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
15.00
1.00 typ.
1
2
3
15.00
TOP VIEW
13.00
13.00
ITEM
NO.
1
2
3
DESCRIPTION
SF Pin Substrate BGA 196
P-S519A, Socket Pin, 1.0mm
centers minimum, #4 clip
Solder Ball, 0.024" Dia
Material
FR4 High temp
Body - Gold Plated Brass 360, Clip -
Gold plated Beryllium Copper 172
See table.
1.59
2.87±0.25
SIDE VIEW
0.51
Description: SF-BGA196 15mm 14x14 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA196C-B-42 Drawing
SF-BGA196C-B-42F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 1.13
PART NO.
SUFFIX
SOLDER BALL ALLOY
-42
-42F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
STATUS: Released
ENG: E. Smolentseva
FILE: SF-BGA196C-B-42
SHEET: 1 OF 1
DRAWN BY: S. Delano
DATE: 5/19/14
REV. A
SCALE: 5:1