SF-BGA169L-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
11.0000
A1
11.0000
9.6000
TOP VIEW
9.6000
2
0.2
ITEM NO.
1
2
3
Description
High Temperature Substrate
High Density Giga-Snap Terminal Pin
0.018" dia 63sn37pb solder ball
3.0
4.9
FRONT VIEW
1
3
Description: Giga-snaP male pin adapter 11x11mm 13x13 array 0.8mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA169L-B-61F Drawing
SF-BGA169L-B-61 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.74
STATUS: Released
ENG: S. Huang
FILE: SF-BGA169L-B-61
PART NO.
SUFFIX
SOLDER BALL ALLOY
-61
-61F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Doc
Rev
Date
Initials Description
A 2/26/16 SH Original
SHEET: 1 OF 1
DRAWN BY: S. Huang
DATE: 2/26/16
REV. A
SCALE: 6:1