SF-BGA156E-B-42F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
1
20.00
17.00
2
3
14.00
11.00
TOP VIEW 1.0000
FRONT VIEW
2.36
0.51
ITEM
NO.
1
2
DESCRIPTION
Pin
Substrate
Material
Body - Gold Plated Brass 360,
Clip - Gold plated Beryllium
Copper 172
FR5 / G11
3
Solder Ball, ROHS
Compliant 0.024" Dia
Sn96.5 Ag3.0 Cu0.5
Description: Giga-snaP BGA SMT Foot 156 pos 1mm pitch 18x12 array 20mm x14mm body.
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA156E-B-42F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 1.31
STATUS: Released
ENG: S. Faiz
FILE: SF-BGA156E-B-42F Dwg
SHEET: 1 OF 1
DRAWN BY: S. Faiz
DATE: 9/1/15
REV. A
SCALE: 3.5:1