SF-BGA144J-B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

0.6mm [0.024"]
0.6mm
[0.024"]
10mm
[0.394"]
0.8mm typ.
Top View
8.8mm square [0.346"]
10mm
[0.394"]
3
1
3.52mm
[0.139"]
1.68mm
[0.066"]
2
Side View
0.2mm dia.
[0.008"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 ^{Solder Balls: Sn63Pb37}
Description: Giga-snaP BGA Surface Mount Foot
144 position BGA solder balls to terminal pins (0.8mm centers, 12x12 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA144J-B-61 Drawing
Status: Released
Scale: 8:1
Rev: A
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: M.A. Fedde
File: SF-BGA144J-B-61 Dwg.mcd
Date: 10/16/08
Modified: