SF-BGA130A-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

0.90mm
12.00mm
1.20mm
9.00mm
7.20mm
0.80mm typ.
1
9.50mm
Top View
0.20mm dia. [0.008"]
4.54mm
[0.179"]
2
0.36mm ± 0.05mm
[0.014" ± 0.002"]
3
Side View
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. 17µm}
[1/2 oz.] Non clad. (RoHS)
Pins: material- Brass Alloy 360 1/2 hard; finish-
2 _{0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).}
3 _{Solder Balls: Sn96.5Ag3.0Cu0.5}
Description: Giga-snaP BGA SMT Foot
130 position (0.8mm pitch) gold plated female pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA130A-B-61F Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 5:1
Rev: B
Drawing: M.A. Fedde
Date: 12/22/08
File: SF-BGA130A-B-61F Dwg
Modified: 07/02/14