SF-BGA128G-B-05F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

21.725
16.725
2.50
2.3625
2.50
3.3625
2.54
21.725 ^{16.725 10.00}
5.08
TOP VIEW
12.00
1.00
2
SOLDER BALL ALLOY
Sn96.5Ag3.0Cu0.5
3
FRONT VIEW
1
0.60 typ.
3.175
0.5
ITEM NO.
1
2
3
PART NUMBER
Substrate
Threaded Insert
Solder ball
DESCRIPTION
Cu clad substrate
#0-80 internal Thread brass insert, Press fit
Solder Ball, 0.024" Dia, See table for alloy
composition
RoHS
Description: BGA Surface Mount Adapter 13x11 array 1mm pitch. To be used with GHz BGA sockets.
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA128G-B-05F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 2.23
STATUS: Released
DRAWN BY: S. Huang
FILE: SF-BGA128G-B-05F
SHEET: 1 OF 1
SCALE: 3:1
DATE: 4/16/13
REV. A