SF-BGA125A-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

12mm [0.472"]
12mm [0.472"]
1.2mm
[0.047"]
0.8mm typ.
Top View
1.2mm
[0.047"]
9.6mm square [0.378"]
4.55mm
2
[0.179"]
1
Side View
0.36mm ± 0.05mm
[0.014" ± 0.002"]
1
2
3
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material;
Non-clad
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Solder Balls: Sn96.5Ag3.0Cu0.5
3
RoHS
Description: Giga-snaP BGA SMT Foot
125 position terminal pins (0.8mm centers, 13x13 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA125A-B-61F Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: B
Drawing: A. Evans
Date: 06/01/09
FFiillee::SSFF-B-BGGAA12112D5-AB-6B1-F61DFwDg.wmgcd.mcd Modified: 07/02/14