SF-BGA120G-B-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

9mm
0.9mm
1.1mm
11mm 8.8mm
0.8mm typ.
Top View
7.2mm
Side View
4.55mm
0.35mm±0.05mm
2
1
3
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material;}
Non-clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3 ^{Solder Balls: Sn96.5Ag3.0Cu0.5}
RoHS
Description: Giga-snaP BGA SMT Foot
120 position terminal pins (0.8mm centers, 10x12 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA120G-B-61F Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 6:1
Rev: B
Drawing: S. Faiz
Date: 7/6/09
File: SF-BGA120G-B-61F Dwg.mcd
Modified: 07/02/14