SF-BGA1156A-B-05 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Orientation Mark
2.3625mm
33mm
2.7375mm 1mm typ.
33mm
5.08mm
2.54mm
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
Ø 0.51mm (x1156) pad
2.5mm±0.13mm
2.5mm±0.13mm
18.863mm (x8)
42.725mm±0.125mm (x4)
0-80 Threaded Insert
Top View
1
0.43mm
[0.017"]
2
3.18mm [0.125"]
Ø 0.61mm [Ø 0.024"]
Side View
Substrate: 3.18mm ±0.18mm [0.125" ±0.007"]
1
FR4/G10 or equivalent high temp material. 17µm
[1/2 oz.] Cu clad. SnPb plating.
2 Solder ball: Eutectic Sn63Pb37
Description: BGA Surface Mount Adaptor
1156 position surface mount land pattern to solder balls. To be used with GHz sockets.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA1156A-B-05 Drawing
Status: Released
Scale: 2:1
Rev: A
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: E Smolentseva
File: SF-BGA1156A-B-05 Dwg
Date: 11/21/08
Modified: