SF-BGA108E-64 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
10.00
0.80 TYP
2
3
1
8.80
10.00
TOP VIEW
8.80
ITEM NO.
1
2
3
Description
Substrate
High Density Giga-Snap
Receptacle
Solder Ball, 0.4572mm dia
Material
High Temp FR4
Brass 360 Full Hard
SEE TABLE
2.56±0.25
FRONT VIEW
0.36
Description: Giga-snaP BGA SMT Foot
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA108E-64 Drawing
SF-BGA108E-64F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.49
STATUS: Released
ENG: M.A. Fedde
FILE: SF-BGA-108E-64F Dwg
SHEET: 1 OF 1
DRAWN BY: D. Hauer
DATE: 06/12/14
REV. A
SCALE: 7:1