SF-BGA108E-61F Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
8.80
10.00
0.80 typ
2
3.87
1
3
0.36±0.05
Description: Giga-snaP BGA foot, 12x12 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"],
substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"]
unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA108E-61F Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 0.39
ITEM NO.
1
2
3
Description
Substrate
Terminal Pin
Solder Ball,
0.4572mm dia
Material
FR4 Standard
Brass-PS-2
SN96.5AG3.0CU0.5, 0.8MA
RoHS Compliant
STATUS: Released
ENG: M.A. Fedde
FILE: SF-BGA108E-61F Dwg
SHEET: 1 OF 1
DRAWN BY: D. Hauer
DATE: 06/12/14
REV. A
SCALE: 7:1