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SF-BGA1089A-B-32 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice
Patent Pending
Top View
Ordering Information:
Solder Ball Alloy Part Number Suffix
Sn63Pb37
-32
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
-32F*
0.93mm
[0.037"]
0.93mm
[0.037"]
42.50mm
[1.673"]
1.27mm
0.050"
1.33mm
[0.052"]
Side View
3.03mm
[0.119"]
2.37mm
1
[0.093"]
Detail A
Detail A
3
4
40.64mm
[1.600"]
2.37mm
[0.093"]
2
0.66mm
[0.026"]
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. (RoHS)
2 Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
4 Solder Balls (See table above)
Description: Giga-snaP BGA SMT Foot
1089 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
R
SF-BGA1089A-B-32(F) Drawing
Status: Released
Scale: 3:1
Rev: B
1
2
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Drawing: S.Natarajan
Date: 6/14/05
Tele: (651) 452-8100
www.ironwoodelectronics.com
File: SF-BGA1089A-B-32 Dwg
Modified: 1/24/06