SF-BGA048U-B-64F Datasheet, PDF (1/2 Pages) Ironwood Electronics. – Primary dimension units are millimeters

PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
A1
6.00
0.80 TYP
2
3
1
8.00
5.60
TOP VIEW
4.24
ITEM NO.
DESCRIPTION
1
High Temp Substrate
2
High Density Giga-Snap Receptacle
3
Solder Ball, 0.4572mm dia (See Table)
2.56±0.25
SIDE VIEW
0.36
Description: Giga-snaP BGA SMT Foot
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA048U-B-64F Drawing
SF-BGA048U-B-64 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: N/A
PART NO.
SUFFIX
SOLDER BALL ALLOY
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
STATUS: Released
ENG: E. Smolentseva
FILE: SF-BGA048U-B-64 Dwg
SHEET: 1 OF 2
DRAWN BY: M. Raske
DATE: 10/07/2013
REV. B
SCALE: 8:1