SBT-BGA-7500 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

15.225
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
15.475
FEATURES:
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
Recommended torque = 2 in-lbs
0.41 BGA end
spring pin compression
13.93
H
Customer's PCB
6.18
3.00
1.52
Description: SBT-BGA228 7x7mm 0.4mm pitch 16x16 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-7500 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish: N/A
Weight: 10.53
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-7500 Dwg
DETAIL H
SCALE 12 : 1
0.13 PCB end
spring pin compression
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 12-10-2013
REV. B
SCALE: 3:1