SBT-BGA-7029 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

13.225
13.475
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
Recommended torque
5.6 N-cm [0.5 lbf-in]
13.90
A
0.40
BGA side compression
0.30
2.20
1.52
2.44
14.73
Description: SBT-BGA72 3.958x4.458mm 9x8 0.5mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-7029 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight: 6.73
STATUS: Released
ENG: J. Vavra
FILE: SBT-BGA-7029 Dwg
DETAIL A
SCALE 25 : 1
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 02/17/2016
REV. A
SCALE: 4:1