SBT-BGA-7009 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead
time
Recommended torque = 8 in-lbs
21.33
21.08
12.82
9.4640
Description: SBT-BGA 15x15mm 0.65mm pitch 22x22 array BGA396
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-7009 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: n/a
Finish: n/a
Weight: 21.11
22.73
FRONT VIEW
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-7009 Dwg
22.73
SIDE VIEW
SHEET: 1 OF 5
DRAWN BY: S. Huang
DATE: 2/25/2013
REV. B
SCALE: 3:1