SBT-BGA-7006 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

A
Top View
1
Approx Assembled height
16.95mm
6
10
Side View
(Section AA)
Customer's
BGA IC
SBT-BGA-7006 Drawing
© 2011 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
SBT-BGA DIRECT MOUNT,
SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
4
3
11
FEATURES:
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
A
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
Socket Lid: Nickel plated Aluminum
1 _{Thickness = 2.5mm.}
Recommended torque = 2 in lb.
Socket base: Ni plated Aluminum.
2 _{Thickness = 5mm.}
9
Compression Plate: Ni plated Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
2
5 ^{Top guide: Ceremic filled Peek}
6 Middle guide: Ceremic filled Peek
12
7 Bottom Guide : Ceremic Filled Peek
5
7
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
8
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Ni plated Aluminum.
Customer's Target PCB ^{11 Thickness = 4mm.}
Pogo pin: SBT BGA 0.5mm
12
Status: Released
Drawing: M. Tully
File: SBT-BGA-7006 Dwg
Scale: -
Rev: A
Date: 4/2/2013
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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