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SBT-BGA-6517 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
34.3
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
B
B
DETAIL C
SCALE 16 : 1
19.7
13
0.80
C
12.9
4.6
29
36.8
SECTION B-B
Description: SBT-BGA1034 40x40 29x29mm 0.7mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6517 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 50.07
STATUS: Released
ENG: B. Schatz
FILE: SBT-BGA-6517 Dwg
11.5
IC FRAME
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 11/20/2013
REV. B
SCALE: 3:2