SBT-BGA-6514 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Highly compliant to accommodate wide co-planarity variations.

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND
TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 4A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead time.
47.00
Recommended torque: 6 in-oz per screw
47.00
47.0
Push Pins not used
47.0
while Heatsink is
attached to socket.
32.0
26.9
3.8
Heatsink attached to BGA Socket mounted to PCB
1.8
Heatsink attached to BGA, soldered to PCB
Description: SBT socket for 13.0mmx13.0mm, 15x15 array, 0.8mm pitch 225 ball BGA with a heatsink (thermal resistance 8.4°C/W)
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6514 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 36.93
STATUS: Released
ENG: S. Faiz
FILE: SBT-BGA-6514
SHEET: 1 OF 4
DRAWN BY: D. Hauer
DATE: 2/8/2013
REV. B
SCALE: 1:1