SBT-BGA-6500 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

21.2250
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
21.60
FEATURES:
Wide temperature range (-55C to +180C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
13.35
5.09
0.4 BGA side
Compression
Recommended
torque = 2 - 3 in-lbs
K
20.03
0.1
DETAIL K
SCALE 16 : 1
Description: SBT-BGA361 for 16x16mm 0.8mm pitch 19x19 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6500 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 18.32
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-6500
SHEET: 1 OF 4
DRAWN BY: S. Huang
DATE: 10/19/12
REV. D
SCALE: 2:1