English
Language : 

SBT-BGA-6039 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield
36.2250
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead
time
DETAIL AA
SCALE 12 : 1
Recommended Torque 8 in-lb/ 90.4 N-cm
15.44 11.1100
AA
1.59
6.35
Description: SBT-BGA 31x31mm 24x24 array 1.27mm pitch BGA380
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6039 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: Material <not specified>
Finish: N/A
Weight: 69.77
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-6039 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 8/4/2015
REV. A
SCALE: 1.5:1