SBT-BGA-6038 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

24.725
23.725
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
24.725
23.725
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production
yield
• Highly compliant to accommodate wide co-planarity
variations
• Automated probe manufacturing enables low cost and short
lead time
RECOMMENDED TORQUE: 1 in-lb
15.44
A
DETAIL A
SCALE 8 : 1
4.00
Description: SBT-BGA Socket, 17 x 17, 1.00mm, 16 x 16 Array 192 ball BGA
SBT PIN (12:1)
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance
±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change
without notice.
SBT-BGA-6038 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 21.69
STATUS: Released
ENG: S. Faiz
FILE: SBT-BGA-6038 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 07/01/2015
REV. A
SCALE: 2:1