SBT-BGA-6023 Datasheet, PDF (1/7 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

24.725
backing plate size
SBT-QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
22.225
socket size
5.00
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 8A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead
time.
3.175 (x4)
15.44
1.75 cutouts
on all four sides
1.59
4.00
5.00 cutouts
on all four sides
Description: SBT-BGA Socket 17x17mm, 1mm, 16x16 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6023 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 20.97
STATUS: Released
DRAWN BY: D. Hauer
FILE: SBT-BGA-6023 Dwg
SHEET: 1 OF 7
SCALE: 2:1
DATE: 09/08/2012
REV. A