SBT-BGA-6022 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

Top View
42.225mm _34.325mm
A
Side View
(Section AA)
1
3
5
9
7
0.2mm
42.225mm
34.325mm
1mm
SBT BGA Socket - Direct mount, solderless
Features
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
A
Socket Lid: Nickel Plated Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Nickel Plated Aluminum.
Thickness = 5mm.
3
Compression Plate: Nickel Plated Aluminum.
Thickness = 2.5mm.
Recommended torque {TBD} in-lbs.
4
5
Compression screw/Heat sink : Nickel Plated Aluminum.
Thickness = 5mm, Hex socket = 5mm.
SBT pin: Stamped contact BeCu, Au plated
Spring: SS, Au plated
4
8
2
Customer's BGA IC
6
5.59mm
6 ^{Pin Guide: Ceramic Filled Peek}
Socket base screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
8 _thread.
Substrate: FR4, 3.175mm thick
9
Pin: Brass - PS-2
10 Plating: 10u" Au over 50u" Ni min.
10 ^1.84mm
SBT-BGA-6022 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S. Faiz
File: SBT-BGA-6022 Dwg.mcd
Scale: -
Rev: A
Date: 12/19/12
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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