SBT-BGA-6021 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

3mm dia hole for thermocouple
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET
FOR BURN-IN AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 8A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide IC package co-
planarity variations.
DETAIL A
SCALE 2 : 1
30.00 heat sink
30.00 fan
10.00 fan
41.46
12.00 heat sink
9.59
A
Description: Socket
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6021 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 85.02
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-6021 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 9/8/2012
REV. B
SCALE: 1.5:1