SBT-BGA-6020 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND
TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 8A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide IC package co-planarity
variations.
30.00 heat sink
12.00 heat sink
DETAIL A
SCALE 2 : 1
3mm dia hole for thermocouple
30.00 fan
10.00 fan
43
Fan/Heatsink and compression assembly can
be hand tightened to the hard stop
9.9
Description: SBT-BGA396, 21mm, with Heatsink and Fan
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6020 Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 68.77
STATUS: Released
DRAWN BY: S. Delano
FILE: SBT-BGA-6020 Dwg
SHEET: 1 OF 5
SCALE: 1:1
DATE: 9/8/2012
REV. A