SBT-BGA-6013 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

A1 corner
SBT-BGA/LGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
Features
50.225
backing plate size
48.100 socket size
• Wide temperature range (-55C to +180C).
• High current capability (up to 2.9A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity
variations.
• Automated probe manufacturing enables low cost and short
lead time.
47.725
Socket size
Floating guide
Middle guide
TOP VIEW
Recommended torque is 1 in lb per screw.
( floating guide in contacting middle guide)
DETAIL A
SCALE 8 : 1
Free state
Floating guide is uncompressed
DETAIL B
SCALE 2 : 1
Compressed state
Floating guide is compressed down
to contact middle guide
DETAIL C
SCALE 2 : 1
9.750 A
B
Customer's target PCB
Free state (BGA option)
Side VIEW
14.650
1.588
6.350
14.050
C
Compressed (BGA option)
SIDE VIEW
Description: SBT Socket, 42.5mm x 42.5mm 1mm pitch 42x42 array BGA/LGA application
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6013 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 121.87
STATUS: Released
ENG: S. Huang
FILE: SBT-BGA-6013 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 2/19/2014
REV. B
SCALE: 1:1