SBT-BGA-6011 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

20.2250
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
20.6000
20.2250
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 4A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead
time.
22.5002
4.7752 (x4)
15.44
2.1590
2.4384
Description: SBT-BGA Socket 15x15mm, 1mm, 14x14 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-BGA-6011 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 12.80
STATUS: Released
ENG: V. Panavala
FILE: SBT-BGA-6011
SHEET: 1 OF 4
DRAWN BY: V. Panavala
DATE: 10/7/2011
REV. B
SCALE: 3:1