SBT-BGA-6007 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead
time
0.375
16.44
7.94
40.60
27.49
0.375
40.225
42.725
Description: Socket Spec
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance
±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change
without notice.
SBT-BGA-6007 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 88.03
STATUS: Released
ENG: S. Faiz
FILE: SBT-BGA-6007 Dwg
42.725
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 10/23/2012
REV. B
SCALE: 3:2