SBT-BGA-6005 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
25
V
27
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time
V
DETAIL A
SCALE 8 : 1
15
A
7
SECTION V-V
Description: SBT-BGA Socket, 19M, 1.00MM, 18 x 18 Array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance
±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change
without notice.
SBT-BGA-6005 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: -
Finish: -
Weight: 25.48
Socket View without Lid
4.00
STATUS: Released
ENG: B. Schatz
FILE: SBT-BGA-6005
SHEET: 1 OF 5
DRAWN BY: B. Schatz
DATE: 7/12/10
REV. C
SCALE: 2:1