SBT-BGA-6000 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Excellent signal integrity at high frequencies

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
42.7250
40.60
Features
• Wide temperature range (-55C to +180C)
• High current capability (up to 8A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead
time
42.7250
40.225
Recommended Torque: 23 in-lbs
R
18.61
1.59
6.35
DETAIL R
SCALE 6 : 1
9.46
Description: SBT-BGA1156 Socket, 35x35, 1.00mm, 34 x 34 Array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance
±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change
without notice.
SBT-BGA-6000 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: Material <not specified>
Finish:
Weight: 80.82
STATUS: Released
ENG: V. Panavala
FILE: SBT-BGA-6000
SHEET: 1 OF 4
DRAWN BY: V. Panavala
DATE: 4/26/2010
REV. F
SCALE: 2:1