LS-BGA92D-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

1mm X 45°Chamfer
1.5mm [0.059"]
11mm [0.433"]
2.3mm [0.091"]
19mm [0.748"]
0.8mm typ.
Top View
4.55mm [0.179"]
2.96mm [0.116"]
1
2
Side View
0.2mm dia. [0.008"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
RoHS
Description: Giga-snaP BGA smt adapter
92 position BGA solder balls to terminal pins (0.8mm centers)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA92D-61 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr Suite 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: E
Drawing: M.A. Fedde
Date: 8/3/06
File: LS-BGA92D-61 Dwg.mcd
Modified: 01/18/13, DH