LS-BGA90B-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – 90 position 0.8mm pitch BGA SMT land pattern to male pins.

Tooling hole (X2)
Y
See BGA pattern code to the
right for actual pattern layout
6.40mm
[0.252"]
Top View
X
(reference only)
3.76mm
[0.148"] _2.17mm
[0.086"]
1
Side View
(reference only)
0.20mm [0.008"] dia.
2
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 ^{FR4/G10 or equivalent high temp material. 17µm}
[1/2 oz.] Cu clad. SnPb plating.
Pins: material- Brass Alloy 360 1/2 hard; finish-
2 _{0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).}
11.20mm
[0.441"]
Top View of Land Pattern
Scale: 2:1
0.80mm typ.
Ø 0.51mm [Ø 0.020"]
BGA pad
0.80mm
[0.031"]
Pin Count
90
Array Size
6x15
Pitch
0.8mm
Adapter Perimeter (XxY) 8.0mm x 12.50mm
Description: Land Socket.
90 position 0.8mm pitch BGA SMT land pattern to male pins.
LS-BGA90B-61 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: N/A
Rev: A
Drawing: J. Glab
Date: 11/01/06
File: LG-BGA90B-61 Dwg.mcd
Modified:
Tolerances: diameters ±0.03mm [±0.001”], PCB
perimeters ±0.13mm [±0.005”], PCB thicknesses
±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm
[±0.005”] unless stated otherwise. Materials and
specifications are subject to change without
notice.