LS-BGA80L-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
2.2mm
[0.087"]
11.6mm
[0.457"]
1.2mm [0.047"]
0.8mm typ.
7.2mm
[0.283"]
5.6mm [0.220"]
8mm [0.315"]
Side View
4.55mm
[0.179"]
2.96mm
[0.117"]
0.2mm dia.
[0.008"]
1
2
RoHS
Substrate: 1.59mm ±0.18mm [0.0625"
1 _{±0.007"] FR4/G10 or equivalent high}
temp material; Non-clad
Pins: material- Brass Alloy 360 1/2
2 ^{hard; finish- 0.25µm [10µ"] Au over}
1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
80 position BGA surface mount land pattern to terminal pins (0.8mm centers, 8x10 array)
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA80L-61 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: LS-BGA80L-61 Dwg.mcd
Scale: 6:1
Rev: C
Date: 7/27/07
Modified: 01/18/13