LS-BGA80F-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

13.00mm [0.512"]
2.00mm [0.079"]
2.00mm
[0.079"]
11.00mm
[0.433"]
Top View
1.00mm typ.
1
Side View
3.99mm
[0.157"]
1.68mm
2 _[0.066"]
Ø 0.25mm [0.010"] ±0.0005"
9.00mm [0.354"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
80 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 9x9 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA80F-41 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: LS-BGA80F-41 Dwg
Scale: 6:1
Rev: A
Date: 11/28/05
Modified: