LS-BGA68C-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

11.90mm [0.469"]
Ø 0.42mm (x68)
[Ø 0.017"]
14.40mm [0.567"]
20.90mm [0.823"]
0.80mm typ.
1
Top View
0.80mm typ.
6.40mm
[0.252"]
Substrate: 1.59mm ±0.18mm [0.062" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
Non-clad.
2 ^{Pins: material- Brass Alloy 360 1/2 hard; finish-}
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
4.55mm [0.179"]
2.96mm [0.116"]
2
Side View
0.20mm [0.008"]
RoHS
Description: Land Socket
68 position BGA SMT pads to 68 position pins. Pin connection is 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without
notice.
LS-BGA68C-61 Drawing
Status: Released
Scale: 4:1
Rev: D
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: J. Glab
File: LS-BGA68C-61 Dwg.mcd
Date: 10/19/06
Modified: 01/17/13, DH