LS-BGA676F-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.00mm
[0.039"]
1.00mm [0.039"]
31.00mm
[1.220"]
31.00mm
[1.220"]
1.00mm
[0.039"]
A
th
be
F
w
A
al
Side View
3.76mm
[0.148"]
1 ^1.68mm
[0.066"]
Ø 0.20mm [0.008"] ±0.0005"
2
29.00mm
[1.142"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
Description: Giga-snaP BGA SMT Land Socket
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
676 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 30x30 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA676F-41 Drawing
Status: Released
Scale: 4:1
Rev: A
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: J. Glab
File: LS-BGA676F-41 Dwg
Date: 02/18/08
Modified: