LS-BGA64M-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice.

8.00mm [0.315"]
Ø 0.42mm pad (x68)
[Ø 0.017"]
11.60mm [0.457"]
8.80mm [0.346"]
0.80mm typ.
1
0.80mm typ.
7.20mm [0.283"]
Top View
4.55mm [0.179"]
2.96mm [0.116"]
RoHS
2
Side View
0.20mm [0.008"]
Substrate: 1.59mm ±0.18mm [0.062" ±0.007"] FR4/G10
1 _{or equivalent high temp material. Non-clad.}
Description: Land Socket
64 position BGA SMT pads to 64 position pins. Pin connection is 1:1.
2
Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm
[10µ"] Au over 1.27µm [50µ"] Ni (min.).
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA64M-61 Drawing
Status: Released
Scale: 4:1
Rev: B
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: Vinayak R
File: LS-BGA64M-61Dwg.mcd
Date: 7/6/09
Modified: 01/17/13, DH