LS-BGA64F-61 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.2mm
[0.047"]
8mm
[0.315"]
5.6mm
[0.220"]
8mm [0.315"]
1.2mm [0.047"]
5.6mm
[0.220"]
0.8mm typ.
4.55mm
[0.179"]
2.96mm
[0.116"]
1
2
RoHS
Side View
0.2mm dia.
[0.008"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material. non}
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
64 position BGA surface mount land pattern to terminal pins (0.8mm centers, 8x8 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA64F-61 Drawing
Status: Released
Scale: 8:1
Rev: D
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Drawing: E Smolentseva
File: LS-BGA64F-61 Dwg.mcd
Date: 4/27/05
Modified: 01/17/13, DH