LS-BGA64E-41 Datasheet, PDF (1/1 Pages) Ironwood Electronics. – Materials and specifications are subject to change without notice

Top View
1.00mm
[0.039"]
9.00mm
[0.354"]
9.00mm
[0.354"]
1.00mm
[0.039"]
1.00mm typ.
Side View
3.76mm
[0.148"]
Ø 0.20mm [0.008"] ±0.0005"
7.00mm [0.276"]
1
1.68mm
2
[0.066"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
1 _{FR4/G10 or equivalent high temp material.}
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
64 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 8x8 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA64E-41 Drawing
Status: Released
Scale: 6:1
Rev: E
© 2004 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Drawing: H. Hansen
File: LS-BGA64E-41 Dwg
Date: 7/26/04
Modified: 12/11/15